Advanced Process Technology

From Gate
to Global.

Sub-2nm process nodes, engineered for the logic that runs every device on earth. Transistor densities that redefine what silicon can carry.

View Process Nodes

Trusted by leading fabless teams

TSMC
ASML
Synopsys
Cadence
ARM
NVIDIA
200Kwpm
Peak Wafer Capacity 2027
45%
Power reduction vs 7nm
2nmGAA
Smallest node in production
CPUGPUNPUDRAMI/OPLLInterconnect Fabric
SIL-2NM
GAA · 2026
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Process Technology

Node by Node.
Every nanometer earned.

Three generations of silicon mastery. Each card reveals a process node — smaller, denser, more power-efficient than the last.

Production Ready
5nm

The maturity benchmark.

Transistor Density
171.3 MTr/mm²
Power Reduction
20% vs 7nm
Performance Gain
10% vs 7nm
Thermal Envelope
< 95W TDP
Tape-out Timeline
12–16 weeks
Transistor Type
FinFET

Consumer electronics, automotive SoCs, 5G modems

Performance vs. Previous Generation

Transistor Density171 MTr/mm²
Power Efficiency20 % gain
Performance Uplift10 % gain
Estimated Annual Capacity
520Kwpm
Stable, mature capacity available
High Demand
3nm

FinFET reaches its limit.

Transistor Density
292 MTr/mm²
Power Reduction
45–50% vs 5nm
Performance Gain
23–30% vs 5nm
Thermal Envelope
< 80W TDP
Tape-out Timeline
14–20 weeks
Transistor Type
FinFET (final gen)

AI accelerators, flagship mobile SoCs, HPC workloads

Performance vs. Previous Generation

Transistor Density292 MTr/mm²
Power Efficiency47 % gain
Performance Uplift26 % gain
Estimated Annual Capacity
280Kwpm
Stable, mature capacity available
Mass Production 2026★ Latest
2nm GAA

The nanosheet era begins.

Transistor Density
400+ MTr/mm²
Power Reduction
75% vs 7nm
Performance Gain
45% vs 7nm
Thermal Envelope
< 65W TDP
Tape-out Timeline
18–24 weeks
Transistor Type
Gate-All-Around (Nanosheet)

Enterprise AI ASICs, edge NPUs, next-gen GPU tiles

Performance vs. Previous Generation

Transistor Density400 MTr/mm²
Power Efficiency65 % gain
Performance Uplift45 % gain
Estimated Annual Capacity
100Kwpm
Scaling to 200K wpm in 2027
Cross-Node Analysis

The density
escalation.

Four generations of silicon, one continuous trajectory. Watch transistor density, power efficiency, and performance compound across nodes — each bar filled by physics itself.

Transistor Density
MTr/mm²
7nm
91.2
5nm
171.3
3nm
292
2nm
400
4.4× more logic per mm² from 7nm to 2nm GAA
Power Efficiency Gain
% vs 7nm
7nm
5nm
20
3nm
45
2nm
75
75% power savings at 2nm — critical for battery-constrained edge AI
Performance Uplift
% vs 7nm
7nm
5nm
10
3nm
23
2nm
45
IBM 2nm prototype: 45% faster at same power vs 7nm baseline
Process Roadmap

The path forward.
Each node smaller than physics allows.

2023
5nm
Full production

FinFET at scale. 520K wpm. Industry workhorse for consumer SoCs.

2024
3nm
Mass production

Second-gen FinFET. 292 MTr/mm². Dominant node for AI mobile.

2025–26
2nm GAA
Mass production underway

Nanosheet transistors. 400+ MTr/mm². 75% power reduction vs 7nm.

2027
1.8nm A18
Next

Specs under NDA. Early access available for qualified partners.

2028+
???
Future

Research phase

Ready to commit to a node?

Sub-5nm capacity is tightening. Supply agreements for 2027 tape-outs require earlier commitments. Start your PDK evaluation now.

Contact Sales
Start your PDK Trial
Corporate email · Node selection · NDA acknowledgment

Process Brief

· PDF · ~2.4 MB

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